FYP S2 WEEK 9

Tittle of activity :

PCB fabrication...hardware step development

Objective :

     PCB Drawing: PCB drawing is designed using Protel DXP 2005. Once the PCB layout has been correctly design, it is now prints out the layout on the A4 size transparent OHP paper. Note that, two types of printers are allowed to print the PCB layout, one is laser printer and the other is carbon type of printer such as Photostat machine. Inkjet and dot matrix type of printer will not work.

Content/procedure :

1.    PCB Cutting: Cut photo PCB size according to the film size.

2.    PCB Photo Etching: Expose the photo PCB in photo etching kit for 8-10minutes.

3.    PCB Developing: Wash the PCB using PCB developer (white powder) for 2 min.

4.    Acid Etching: Etching is a process that removes materials from such us unwanted copper from the PCB surface to achieve circuit design requirements. The etching process used in this project is called chemical etch or pattern etch. 

Result:

PCB print layout

Step 1

Step 2

Step 3

Step 4 

FYP S2 WEEK 8

Tittle of activity :

Web cam...test2

Objective :

Modified web cam so that it can connect to main circuit.

Content/procedure :

Tools:

• Soldering gun & lead
• Jumper wire

Step 1:

 

Before modified

Step 2:

Remove the insulation 

Step 3:

Cut the Vcc cable

Step 4:

Connect the cable to jumper wire

Step 5:

Cover it with tape

Step 6:

After, ready connect to main circuit

FYP S2 WEEK 7

Tittle of activity :

Simulation on protel....

Objective :

Construct the project on the protel sofware

Content/procedure :

Schematic Diagram

FYP S2 WEEK 6

Tittle of activity :

Briefing 2....start buying component

Objective :

Second briefing for this semester.

Content/procedure :

1. Report

In this week, there been held the FYP briefing to guide student about how to write the report properly and gain maximum marks and knowledge to implemented to the work environment.For the report writing updating process, the focus is more to the chapter 1, 2 and 3 but yet not finishing the chapter 3 (methodology) because the process of this project still ongoing and it will be updating from time to time. 

2. Project

In this week I start to buy a component.

a) maxsonar-EZ1

Features:

• 42kHz Ultrasonic sensor
• Operates from 2.5-5.5V
• Low 2mA supply current
• 20Hz reading rate
• RS232 Serial Output - 9600bps
• Analog Output - 10mV/inch
• PWM Output - 147uS/inch
• Small, light weight module

b) LCD 

c) Web camera